OUR THREE ASSEMBLY LINES
SMT Board Assembly
This department consists of five latest-generation assembly lines, and guarantees a production rate of over 100,000 components/hour.
The SMT department is organized to ensure a wide production flexibility and all the equipment involved in the production is configured to reach the maximum production capacity with the possibility of assembling different types of boards at the same time.
The machines in this department reflect the characteristics required by the government’s Industry 4.0 plan and already include advanced telediagnosis and remote control systems, as well as systems for monitoring working conditions and work processes. Furthermore, they are characterized by:
- Advanced automated integration.
- Intelligent sensors.
- Analysis and monitoring systems and software.
- Digital CNC 4.0 with intelligent interface that supports the operator.
- Design of customized solutions.
- Latest generation interconnection to the company information system.
This has allowed us to embrace the philosophy of Lean Production, allowing us to reduce waste without sacrificing productivity and also diversifying products.
It thus becomes possible to plan production in order to optimize all aspects of the assembly flow, optimally combining the need to change products even several times, during the same day, with that of producing as many pieces as possible every day.
Through the wise use of all the data available in the plant, it is possible to carry out planning at the level of both the individual machine and the line, as well as the supply of materials. Process simulation also allows us to hypothesize any variants in advance and simulate the results by means of integrated ERP and MRP management systems, as well as the MES.
As for the assembly machine technology, the screen printers ensure excellent printing precision, while the latest generation pick&place lines have a SIGMA3 assembly precision, allowing the assembly of any type of component (0.2 x 0.1 mils in the case of minimum size) including QFP, BGA, uBGA. The ovens are set up with temperature profiles suitable for the reflow of electronic boards, protecting the electronic components from thermal stress.
Each processing step is subject to Quality Control by department personnel, with further adjustments to maximize production volumes without sacrificing or compromising the required level of quality.
NEOS SISTEMI
We take electronics to a new level
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